BOX BUILD ASSEMBLY
FINE PITCH QFP
BGA WITH HEATSINK
PCBA MODIFICATION
MULTIPLE SMT LINES

Capabilities

Saline Lectronics offers the latest technical capabilities to meet your most demanding project requirements for circuit card assembly. Whether we assemble your product with BGA, Micro-BGA, Surface Mount or Through-Hole Technology, we work closely with you, the customer, to ensure that you are 100% satisfied.

Saline Lectronics specializes in new product introduction for volume production. Our technical capabilities include multiple, linked continuous flow production lines, dedicated aqueous and no-clean solder chemistry, potting and conformal coating, and final product assembly (box builds).

At Saline Lectronics our printed circuit card assembly services include:

• Single sided PCBA using a single sided PCB, as well as double-sided assemblies using PCBs of 2 to 30+ layers. We pride ourselves on taking care of complex projects consisting of high technology, multi-layer boards.
• Rigid or flex PCBAs.
• Any cable harnesses or wiring that may be required for certain product assemblies. We may outsource the production of these items, but Saline Lectronics will work with you to conveniently meet all of your printed circuit card assembly requirements.

Assembly Materials

We work with PCB blanks made from:

• FR4 consisting of various laminates. (For low temperatures: tin or lead. For high temperatures: lead free.)
• CEM-1 Composite material composed of woven glass fabric surfaces and paper core combined with epoxy resin (as is typical in the printed circuit card industry). CEM-1 provides excellent mechanical and electrical properties, and punches well up to .093".

Our board finishes vary with product and component technology levels. For lower level product technology - printed circuit cards assembled without fine pitch or BGA component technology - we typically use HASL (Hot Air Solder Leveling). For high level product technology - printed circuit card assemblies with fine pitch or BGA - we usually specify ENIG (Electroless Nickel Immersion Gold) or IAg (Immersion Silver).

How To Get Started

The Saline Lectronics team prefers a complete set of documentation in order to provide an accurate quote. This includes:

• A BOM (Bill of Material) with reference designators: component description, manufacturer's name and part number.
• PCB Gerber files.
• A PCB fabrication drawing and PCBA assembly drawing.
• Test procedures.
• Any mechanical restrictions such as assembly height requirements.

For printed circuit card assembly, you'll find Saline Lectronics is unmatched in delivery and customer service. Our 40,000 square foot static-controlled production facility has the technology to deliver timely, on-budget assembly of high-complexity printed circuit boards in mid to high volume quantities. And our experienced customer service team has the dedication to guarantee your complete satisfaction. Contact us to get started.